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CISDI and HUAWEI join forces to bring hi-tech to steel manufacture

Date:2019/7/17 Source: CISDI

CISDI and HUAWEI join forces to bring hi-tech to steel manufacture

Strategic co-operation agreement will push forward new technology for intelligent steel manufacturing

 

Two of China’s biggest enterprises are now working hand-in-hand to create major new technological advances which will transform the country’s steel industry.

CISDI and HUAWEI have consolidated their working relationship by signing a strategic co-operation agreement.

The document was signed in early June, eight months after the Chinese giants signed their first agreement on achieving mutual goals.

CISDI leads China’s engineering sector when it comes to applying information technology to management systems, and has taken the lead on developing systems for steel intelligent manufacturing, smart city and smart agriculture.

A leading global provider of information and communications technology, infrastructure and smart devices, HUAWEI has been focused on ICT infrastructure and intelligent terminals. The tech giant is committed to building a world-class open public cloud which will enable global offline services.

The latest agreement will see the two companies collaborate across-the-board on cloud computing, internet of things, 5G, big data, artificial intelligence, chip and the industrial internet. Their aim is to apply their new technologies to intelligent steel manufacturing and the smart city.

CISDI’s 61 years of expertise and experience will be ploughed into HUAWEI’s chip development, a Chinese first which will link to a corporate cloud.

Both parties will jointly conduct studies on the standards for industrial big data, formulating an access standard and setting a benchmark for the industry.

 

說明: http://3w.cisdi.com.cn/files.upload/20190614_15113103/20190514151357-1.jpg

CISDI and HUAWEI representatives at the signing of the new agreement